InTech-2000
The InTech -2000 is a high-speed, high efficiency, stable electroplating system designed for the rapid deposition of pure indium at a wide range of current densities.
M-Contact InTech-2000 offers the advantage of being a pure indium, lead-free, plating process
providing an ultra-soft deposit that yields a uniform grain size, which is an excellent alternative to reduce the tendency for whisker growth. The process results in uniform, matte white deposits over a very wide cathode current density range. The resulting deposits have excellent reflow properties and are great for press fit applications.
InTech -2000是一种高速、高效、稳定的电镀系统，专为在广泛的电流密度下快速沉积纯铟而设计。 InTech -2000具有纯铟无铅电镀工艺的优势，提供超软镀层，产生均匀的晶粒尺寸，这是减少晶须生长趋势的绝佳选择。该工艺在极宽的阴极电流密度范围内产生均匀的哑光白色沉积 物。所得到的沉积物具有优异的回流性能，对压滤效果很好。
READ ENTIRE TECHNICAL DATA SHEET BEFORE USING THIS PRODUCT
在使用本产品之前，请阅读完整的技术说明书
Features 特性 | Benefits 优点 |
Operates over a wide current density range
在宽电流密度范围内工作 | Uniform plating thickness regardless of part geometry 镀层厚度均匀，不考虑零件几何形状 |
Analyzable additives 可分析的添加剂 | Easy to maintain and control 易于维护和控制 |
Simplified effluent treatment 简化污水处理 |
Environmentally friendly process 环保工艺 |
High efficiency 效率高 | Consistent plating rate throughout the life of the bath 在镀液的整个使用寿命中保持一致的镀速 |
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